Package & SI/PI - Senior/Staff Packaging Engineer - Electro-Thermal

Eliyan is building a proprietary die-to-die chiplet interconnect fabric for AI infrastructure at hyperscale.

Bay Area Full-time Posted 8mo ago semiconductorai infrastructurechiplets

Join the leading chiplet interconnect startup! We are seeking an experienced Senior/Staff Packaging Engineer specializing in electro-thermal simulation to join our advanced packaging team. You will develop comprehensive thermal and electrical simulations for next-generation semiconductor packaging solutions, including 2.5D/3D IC integration, chiplet-based systems, and advanced heterogeneous integration technologies. This role is critical in enabling high-performance computing, AI accelerators, and advanced chiplet architectures. We offer a fun work environment with excellent benefits. ONSITE M-F

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